Issued Patents 2020
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879225 | Semiconductor package and method of manufacturing semiconductor package | Won Keun Kim, Hwa-il Jin, Dong Kwan Kim, Yeong Seok Kim, Jae Choon Kim +1 more | 2020-12-29 |
| 10861826 | Substrate assembly semiconductor package including the same and method of manufacturing the semiconductor package | Do Hyun Kim, Sunwon Kang | 2020-12-08 |
| 10854551 | Semiconductor package and method of fabricating the same | Hae-Jung Yu | 2020-12-01 |
| 10797021 | Semiconductor packages having improved thermal discharge and electromagnetic shielding characteristics | Won Keun Kim, Ji-Han Ko, Kil-Soo Kim, Yeong Seok Kim, Joung Phil Lee +2 more | 2020-10-06 |
| 10770124 | Memory device comprising programmable command-and-address and/or data interfaces | Ian Shaeffer, Lawrence Lai, Fan Ho, David A. Secker, Wayne S. Richardson +2 more | 2020-09-08 |
| 10756015 | Semiconductor package, package-on-package device, and method of fabricating the same | Seokhyun Lee | 2020-08-25 |
| 10748871 | Semiconductor chip and semiconductor package including the same | Seong-Hwan Oh, Kilsoo Kim | 2020-08-18 |
| 10727199 | Electronic device including semiconductor device package | Yong Hoon Kim, Kil-Soo Kim, Tae-Joo Hwang | 2020-07-28 |
| 10720196 | On-die termination of address and command signals | Ian Shaeffer | 2020-07-21 |
| 10699983 | Semiconductor package | Kil-Soo Kim, Yong Hoon Kim, Hyun Ki Kim | 2020-06-30 |
| 10674597 | Structure for delivering power | Ralf M. Schmitt, Yijiong Feng | 2020-06-02 |
| 10651849 | Transaction-based on-die termination | Ian Shaeffer | 2020-05-12 |
| 10541201 | Semiconductor package, package-on-package device, and method of fabricating the same | Seokhyun Lee | 2020-01-21 |
| 10536304 | Receiver with clock recovery circuit and adaptive sample and equalizer timing | Qi Lin, Brian S. Leibowitz, Hae-Chang Lee, Jihong Ren, Jared L. Zerbe | 2020-01-14 |