Issued Patents 2020
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10861826 | Substrate assembly semiconductor package including the same and method of manufacturing the semiconductor package | Kyung Suk Oh, Do Hyun Kim | 2020-12-08 |
| 10797030 | Semiconductor packages | Sangnam JEONG, IlJoon Kim | 2020-10-06 |
| 10720382 | Semiconductor package structure and semiconductor module including the same | YoungJoon Lee | 2020-07-21 |
| 10720408 | High-speed semiconductor modules | Kyoungsoo Kim | 2020-07-21 |