Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879294 | Image sensor package having multi-level stack structure | Yong Hoon Kim, Seung-Yong Cha, Jae Choon Kim | 2020-12-29 |
| 10541263 | Image sensor package having multi-level stack structure | Yong Hoon Kim, Seung-Yong Cha, Jae Choon Kim | 2020-01-21 |