Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10692846 | Package-on-package (PoP) semiconductor package and electronic system including the same | Tong-suk Kim | 2020-06-23 |
| 10546844 | Stack package and method of manufacturing the stack package | Jae Choon Kim, Eon Soo Jang, Eun-Hee Jung, Hyon-chol Kim | 2020-01-28 |