Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10672707 | Low aspect ratio interconnect | Benjamin D. Briggs, Elbert E. Huang, Raghuveer R. Patlolla, Cornelius Brown Peethala, Chih-Chao Yang | 2020-06-02 |
| 10607933 | Interconnect structures with fully aligned vias | Daniel C. Edelstein, Nicholas C. M. Fuller, Elbert E. Huang, Satyanarayana V. Nitta | 2020-03-31 |
| 10600884 | Additive core subtractive liner for metal cut etch processes | Ruqiang Bao, Kisup Chung, Andrew M. Greene, Sivananda K. Kanakasabapathy, Indira Seshadri +1 more | 2020-03-24 |