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Cooling and power delivery for a wafer level computing board |
Babar A. Khan, Kamal K. Sikka |
2020-11-03 |
| 10761641 |
Dynamic on-demand joint processing of touch sensor data from multiple independent touch sensors at an electronic circuit |
Antonio S. Cheng, Chai Huat Gan |
2020-09-01 |
| 10734492 |
Asymmetric high-k dielectric for reducing gate induced drain leakage |
Anthony I. Chou, Chung-Hsun Lin, Shreesh Narasimha, Claude Ortolland, Jonathan T. Shaw |
2020-08-04 |
| 10727232 |
Dram and method of making |
Mahendra Pakala, Sanjeev Manhas, Satendra Kumar Gautam |
2020-07-28 |
| 10724869 |
Technologies for providing information to a user while traveling |
Ren Wang, Zhonghong Ou, Kristoffer Fleming, Tsung-Yuan C. Tai, Timothy J. Gresham +2 more |
2020-07-28 |
| 10707224 |
FinFET vertical flash memory |
Ramachandra Divakaruni, Carl Radens |
2020-07-07 |
| D888711 |
Computer notebook |
Jim Okuley, Murali Veeramoney, Prosenjit Ghosh, Denica N. Larsen, Martin Bone +2 more |
2020-06-30 |
| 10672907 |
Channel region dopant control in fin field effect transistor |
Murshed Chowdhury, Brian J. Greene |
2020-06-02 |
| 10671910 |
Space-efficient dynamic addressing in very large sparse networks |
Winfried W. Wilcke |
2020-06-02 |
| 10649550 |
Predictive detection of user intent for stylus use |
Amy Wiles |
2020-05-12 |
| 10613754 |
Architecture and implementation of cortical system, and fabricating an architecture using 3D wafer scale integration |
Daniel G. Berger, Troy L. Graves-Abe, Subramanian S. Iyer, Toshiaki Kirihata, Winfried W. Wilcke |
2020-04-07 |
| 10606738 |
Application testing on a blockchain |
Vijay Kumar Ananthapur Bache, Jhilam Bera, Bidhu Ranjan Sahoo |
2020-03-31 |
| 10580738 |
Direct bonded heterogeneous integration packaging structures |
Kamal K. Sikka, Jon A. Casey, Joshua M. Rubin, Dinesh Gupta, Charles L. Arvin +5 more |
2020-03-03 |
| 10580686 |
Semiconductor structure with integrated passive structures |
Anthony I. Chou, Renee T. Mo, Shreesh Narasimha |
2020-03-03 |
| 10566058 |
Ternary content addressable memory |
Igor Arsovski, Suparna Bhattacharya |
2020-02-18 |
| 10546809 |
Wafer-scale power delivery |
Charles E. Cox, Harald Huels, Xiao Hu Liu, Ahmet S. Ozcan, Winfried W. Wilcke |
2020-01-28 |