Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10613754 | Architecture and implementation of cortical system, and fabricating an architecture using 3D wafer scale integration | Daniel G. Berger, Subramanian S. Iyer, Toshiaki Kirihata, Arvind Kumar, Winfried W. Wilcke | 2020-04-07 |