Issued Patents 2020
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10740282 | Interconnect circuits at three-dimensional (3-D) bonding interfaces of a processor array | Rodrigo Alvarez-Icaza Rivera, John V. Arthur, John E. Barth, Jr., Andrew S. Cassidy, Bryan L. Jackson +3 more | 2020-08-11 |
| 10657231 | Providing an authenticating service of a chip | Srivatsan Chellappa, Toshiaki Kirihata, Sami Rosenblatt | 2020-05-19 |
| 10613754 | Architecture and implementation of cortical system, and fabricating an architecture using 3D wafer scale integration | Daniel G. Berger, Troy L. Graves-Abe, Toshiaki Kirihata, Arvind Kumar, Winfried W. Wilcke | 2020-04-07 |
| 10585643 | Fine-grained analog memory device based on charge-trapping in high-K gate dielectrics of transistors | Xuefeng Gu | 2020-03-10 |