Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10818570 | Stacked semiconductor devices having dissimilar-sized dies | Luke England | 2020-10-27 |
| 10613754 | Architecture and implementation of cortical system, and fabricating an architecture using 3D wafer scale integration | Troy L. Graves-Abe, Subramanian S. Iyer, Toshiaki Kirihata, Arvind Kumar, Winfried W. Wilcke | 2020-04-07 |