Issued Patents 2020
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10840260 | Through-array conductive via structures for a three-dimensional memory device and methods of making the same | James Kai, Fumiaki Toyama, Johann Alsmeier, Masaaki Higashitani | 2020-11-17 |
| 10777570 | Multi-tier three-dimensional memory devices containing annular dielectric spacers within memory openings and methods of making the same | Tadashi Nakamura, Jin Liu, Kazuya Tokunaga, Marika Gunji-Yoneoka, Matthias Baenninger +2 more | 2020-09-15 |
| 10748894 | Three-dimensional memory device containing bond pad-based power supply network for a source line and methods of making the same | Kwang Ho Kim, James Kai, Johann Alsmeier | 2020-08-18 |
| 10727216 | Method for removing a bulk substrate from a bonded assembly of wafers | James Kai, Koichi Matsuno, Johann Alsmeier | 2020-07-28 |
| 10672907 | Channel region dopant control in fin field effect transistor | Brian J. Greene, Arvind Kumar | 2020-06-02 |
| 10629616 | Bonded three-dimensional memory devices and methods of making the same by replacing carrier substrate with source layer | James Kai, Ching-Huang Lu, Johann Alsmeier | 2020-04-21 |