Issued Patents 2020
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879269 | Ferroelectric memory device containing a series connected select gate transistor and method of forming the same | Yanli Zhang | 2020-12-29 |
| 10868042 | Ferroelectric memory device containing word lines and pass gates and method of forming the same | Yanli Zhang | 2020-12-15 |
| 10840260 | Through-array conductive via structures for a three-dimensional memory device and methods of making the same | James Kai, Murshed Chowdhury, Fumiaki Toyama, Masaaki Higashitani | 2020-11-17 |
| 10825826 | Three-dimensional memory device having bonding structures connected to bit lines and methods of making the same | Jixin Yu, Tae Kyung Kim, Yan Li, Jian Chen | 2020-11-03 |
| 10811058 | Bonded assembly containing memory die bonded to integrated peripheral and system die and methods for making the same | Yanli Zhang, Zhixin Cui, Akio Nishida, Yan Li, Steven T. Sprouse | 2020-10-20 |
| 10748894 | Three-dimensional memory device containing bond pad-based power supply network for a source line and methods of making the same | Murshed Chowdhury, Kwang Ho Kim, James Kai | 2020-08-18 |
| 10727216 | Method for removing a bulk substrate from a bonded assembly of wafers | James Kai, Murshed Chowdhury, Koichi Matsuno | 2020-07-28 |
| 10727215 | Three-dimensional memory device with logic signal routing through a memory die and methods of making the same | Yanli Zhang, Kwang Ho Kim | 2020-07-28 |
| 10707228 | Three-dimensional memory device having bonding structures connected to bit lines and methods of making the same | Jixin Yu, Tae Kyung Kim, Yan Li, Jian Chen | 2020-07-07 |
| 10658381 | Memory die having wafer warpage reduction through stress balancing employing rotated three-dimensional memory arrays and method of making the same | Jixin Yu, Fumiaki Toyama, Masaaki Higashitani, Tong Zhang, Chun Ge +1 more | 2020-05-19 |
| 10629616 | Bonded three-dimensional memory devices and methods of making the same by replacing carrier substrate with source layer | James Kai, Ching-Huang Lu, Murshed Chowdhury | 2020-04-21 |
| 10622369 | Three-dimensional memory device including contact via structures that extend through word lines and method of making the same | Fei Zhou, Raghuveer S. Makala, Hiroyuki Kinoshita, Yanli Zhang, James Kai +2 more | 2020-04-14 |