Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10811058 | Bonded assembly containing memory die bonded to integrated peripheral and system die and methods for making the same | Yanli Zhang, Zhixin Cui, Akio Nishida, Johann Alsmeier, Yan Li | 2020-10-20 |
| 10740228 | Locality grouping during garbage collection of a storage device | Neil David Hutchison, Shakeel Isamohiuddin Bukhari | 2020-08-11 |
| 10684794 | Distributed power management for non-volatile memory controllers | Reed P. Tidwell, Satish B. Vasudeva, James M. Higgins, Jonathan Q. Tu | 2020-06-16 |