Issued Patents 2020
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879116 | Method for copper plating through silicon vias using wet wafer back contact | Roman Gouk | 2020-12-29 |
| 10818490 | Controlled growth of thin silicon oxide film at low temperature | Shishi Jiang, Kurtis Leschkies, Pramit Manna, Abhijit Basu Mallick | 2020-10-27 |
| 10777405 | Drying process for high aspect ratio features | Roman Gouk, Han-Wen Chen, Jean Delmas | 2020-09-15 |
| 10727083 | Method for via formation in flowable epoxy materials by micro-imprint | Roman Gouk, Chintan Buch, Kyuil Cho, Han-Wen Chen, Vincent DiCaprio | 2020-07-28 |
| 10636677 | High pressure and high temperature anneal chamber | Jean Delmas, Kurtis Leschkies | 2020-04-28 |
| 10573510 | Substrate support and baffle apparatus | Roman Gouk, Han-Wen Chen, Jean Delmas | 2020-02-25 |
| 10559496 | Techniques for filling a structure using selective surface modification | Kurtis Leschkies | 2020-02-11 |