Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879116 | Method for copper plating through silicon vias using wet wafer back contact | Steven Verhaverbeke | 2020-12-29 |
| 10777405 | Drying process for high aspect ratio features | Han-Wen Chen, Steven Verhaverbeke, Jean Delmas | 2020-09-15 |
| 10727083 | Method for via formation in flowable epoxy materials by micro-imprint | Chintan Buch, Kyuil Cho, Han-Wen Chen, Steven Verhaverbeke, Vincent DiCaprio | 2020-07-28 |
| 10573510 | Substrate support and baffle apparatus | Han-Wen Chen, Steven Verhaverbeke, Jean Delmas | 2020-02-25 |