Issued Patents 2019
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10457779 | Tetracarboxylic acid diester compound, polyimide precursor polymer and method for producing the same, negative photosensitive resin composition, positive photosensitive resin composition, patterning process, and method for forming cured film | Katsuya Takemura, Hiroyuki Urano, Masashi Iio, Masayoshi Sagehashi | 2019-10-29 |
| 10424896 | Laser light source module and method of specifying failure laser diode | — | 2019-09-24 |
| 10363555 | Polymer compound for conductive polymer and method for producing the same | Jun Hatakeyama, Masaki Ohashi, Masayoshi Sagehashi, Takayuki Nagasawa | 2019-07-30 |
| 10308735 | Material for organic light-emitting device and organic light-emitting device including the same | Masashi Tsuji, Makoto Taguchi | 2019-06-04 |
| 10310376 | Resist composition, pattern forming process, polymer, and monomer | Teppei Adachi, Ryosuke Taniguchi, Kenji Yamada | 2019-06-04 |
| 10303056 | Resist composition and patterning process | Jun Hatakeyama, Masayoshi Sagehashi | 2019-05-28 |
| 10286514 | Spindle condition detection device for machine tool | Koji Kito, Takashi Matsui, Nobumitsu Hori, Osamu Higashimoto | 2019-05-14 |
| 10216085 | Tetracarboxylic acid diester compound, polyimide precursor polymer and method for producing the same, negative photosensitive resin composition, patterning process, and method for forming cured film | Katsuya Takemura, Hiroyuki Urano, Masashi Iio, Masayoshi Sagehashi | 2019-02-26 |
| 10203601 | Tetracarboxylic acid diester compound, polymer of polyimide precursor and method for producing same, negative photosensitive resin composition, patterning process, and method for forming cured film | Hiroyuki Urano, Katsuya Takemura, Masashi Iio, Kenji Funatsu | 2019-02-12 |