Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10457779 | Tetracarboxylic acid diester compound, polyimide precursor polymer and method for producing the same, negative photosensitive resin composition, positive photosensitive resin composition, patterning process, and method for forming cured film | Katsuya Takemura, Hiroyuki Urano, Masashi Iio, Koji Hasegawa | 2019-10-29 |
| 10363555 | Polymer compound for conductive polymer and method for producing the same | Jun Hatakeyama, Koji Hasegawa, Masaki Ohashi, Takayuki Nagasawa | 2019-07-30 |
| 10303056 | Resist composition and patterning process | Jun Hatakeyama, Koji Hasegawa | 2019-05-28 |
| 10216085 | Tetracarboxylic acid diester compound, polyimide precursor polymer and method for producing the same, negative photosensitive resin composition, patterning process, and method for forming cured film | Katsuya Takemura, Hiroyuki Urano, Masashi Iio, Koji Hasegawa | 2019-02-26 |