Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10457779 | Tetracarboxylic acid diester compound, polyimide precursor polymer and method for producing the same, negative photosensitive resin composition, positive photosensitive resin composition, patterning process, and method for forming cured film | Katsuya Takemura, Masashi Iio, Masayoshi Sagehashi, Koji Hasegawa | 2019-10-29 |
| 10216085 | Tetracarboxylic acid diester compound, polyimide precursor polymer and method for producing the same, negative photosensitive resin composition, patterning process, and method for forming cured film | Katsuya Takemura, Masashi Iio, Masayoshi Sagehashi, Koji Hasegawa | 2019-02-26 |
| 10203601 | Tetracarboxylic acid diester compound, polymer of polyimide precursor and method for producing same, negative photosensitive resin composition, patterning process, and method for forming cured film | Katsuya Takemura, Masashi Iio, Koji Hasegawa, Kenji Funatsu | 2019-02-12 |
| 10197914 | Positive photosensitive resin composition, photo-curable dry film and method for producing the same, patterning process, and laminate | Katsuya Takemura, Masashi Iio, Takashi Miyazaki | 2019-02-05 |