Issued Patents 2019
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10457779 | Tetracarboxylic acid diester compound, polyimide precursor polymer and method for producing the same, negative photosensitive resin composition, positive photosensitive resin composition, patterning process, and method for forming cured film | Hiroyuki Urano, Masashi Iio, Masayoshi Sagehashi, Koji Hasegawa | 2019-10-29 |
| 10319653 | Semiconductor apparatus, stacked semiconductor apparatus, encapsulated stacked-semiconductor apparatus, and method for manufacturing the same | Kyoko Soga, Satoshi Asai, Kazunori Kondo, Michihiro Sugo, Hideto Kato | 2019-06-11 |
| 10216085 | Tetracarboxylic acid diester compound, polyimide precursor polymer and method for producing the same, negative photosensitive resin composition, patterning process, and method for forming cured film | Hiroyuki Urano, Masashi Iio, Masayoshi Sagehashi, Koji Hasegawa | 2019-02-26 |
| 10203601 | Tetracarboxylic acid diester compound, polymer of polyimide precursor and method for producing same, negative photosensitive resin composition, patterning process, and method for forming cured film | Hiroyuki Urano, Masashi Iio, Koji Hasegawa, Kenji Funatsu | 2019-02-12 |
| 10197914 | Positive photosensitive resin composition, photo-curable dry film and method for producing the same, patterning process, and laminate | Masashi Iio, Hiroyuki Urano, Takashi Miyazaki | 2019-02-05 |