Issued Patents 2019
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10453732 | Wafer laminate and making method | Hiroyuki Yasuda, Michihiro Sugo | 2019-10-22 |
| 10416559 | Film material and pattern forming process | Satoshi Asai, Kyoko Soga | 2019-09-17 |
| 10373903 | Laminate and making method | Hiroyuki Yasuda, Michihiro Sugo, Kazunori Kondo | 2019-08-06 |
| 10319653 | Semiconductor apparatus, stacked semiconductor apparatus, encapsulated stacked-semiconductor apparatus, and method for manufacturing the same | Katsuya Takemura, Kyoko Soga, Satoshi Asai, Kazunori Kondo, Michihiro Sugo | 2019-06-11 |
| 10297485 | Semiconductor device, making method, and laminate | Hiroyuki Yasuda, Michihiro Sugo, Kazunori Kondo | 2019-05-21 |