Issued Patents 2019
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10453732 | Wafer laminate and making method | Hiroyuki Yasuda, Hideto Kato | 2019-10-22 |
| 10451970 | Silicone skeleton-containing polymer, photo-curable resin composition, photo-curable dry film, laminate, and patterning process | Hitoshi Maruyama, Kazunori Kondo | 2019-10-22 |
| 10373903 | Laminate and making method | Hiroyuki Yasuda, Hideto Kato, Kazunori Kondo | 2019-08-06 |
| 10319653 | Semiconductor apparatus, stacked semiconductor apparatus, encapsulated stacked-semiconductor apparatus, and method for manufacturing the same | Katsuya Takemura, Kyoko Soga, Satoshi Asai, Kazunori Kondo, Hideto Kato | 2019-06-11 |
| 10308787 | Resin composition, resin film, method for producing resin film, method for producing semiconductor device, and semiconductor device | Kazunori Kondo, Yoichiro Ichioka | 2019-06-04 |
| 10297485 | Semiconductor device, making method, and laminate | Hiroyuki Yasuda, Hideto Kato, Kazunori Kondo | 2019-05-21 |
| 10242902 | Wafer processing laminate, temporary adhesive material for wafer processing, and method for manufacturing thin wafer | Hiroyuki Yasuda, Shohei Tagami, Masahito Tanabe | 2019-03-26 |