Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10242902 | Wafer processing laminate, temporary adhesive material for wafer processing, and method for manufacturing thin wafer | Michihiro Sugo, Hiroyuki Yasuda, Shohei Tagami | 2019-03-26 |