Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10431522 | Thermal interface material layer and package-on-package device including the same | Min-Ok Na, Hyo-Chang Ryu, Jin-Woo Park, BongJin Son, Jangwoo Lee | 2019-10-01 |
| 10211159 | Semiconductor packages having semiconductor chips disposed in opening in shielding core plate | Yoonha Jung, Bona Baek, Heeseok Lee, Kyoungsei Choi | 2019-02-19 |