HL

Heeseok Lee

Samsung: 1 patents #6,950 of 16,573Top 45%
Overall (2019): #448,218 of 560,194Top 85%
1
Patents 2019

Issued Patents 2019

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
10211159 Semiconductor packages having semiconductor chips disposed in opening in shielding core plate Yoonha Jung, Jongkook Kim, Bona Baek, Kyoungsei Choi 2019-02-19