Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10262971 | Stacked image sensor package and stacked image sensor module including the same | Un-Byoung Kang, Yungcheol Kong | 2019-04-16 |
| 10211159 | Semiconductor packages having semiconductor chips disposed in opening in shielding core plate | Yoonha Jung, Jongkook Kim, Bona Baek, Heeseok Lee | 2019-02-19 |
| 10177188 | Semiconductor package and method of fabricating the same | Un-Byoung Kang, Yungcheol Kong, Hyunsu Jun | 2019-01-08 |