Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10211159 | Semiconductor packages having semiconductor chips disposed in opening in shielding core plate | Jongkook Kim, Bona Baek, Heeseok Lee, Kyoungsei Choi | 2019-02-19 |
YJ
Yoonha Jung
Overall (2019): #211,214 of 560,194Top 40%
1
Patents 2019