Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10431522 | Thermal interface material layer and package-on-package device including the same | Min-Ok Na, Jongkook Kim, Hyo-Chang Ryu, Jin-Woo Park, Jangwoo Lee | 2019-10-01 |
| 10319619 | Equipment for manufacturing semiconductor devices and method for use of same for manufacturing semiconductor package components | Yose Eum, Jangwoo Lee | 2019-06-11 |