Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10431522 | Thermal interface material layer and package-on-package device including the same | Jongkook Kim, Hyo-Chang Ryu, Jin-Woo Park, BongJin Son, Jangwoo Lee | 2019-10-01 |
| 10403606 | Method of fabricating a semiconductor package | Heung-Kyu Kwon, Sung-Woo Park, Ji Hyun Park, Su-Min Park | 2019-09-03 |