Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10403606 | Method of fabricating a semiconductor package | Min-Ok Na, Sung-Woo Park, Ji Hyun Park, Su-Min Park | 2019-09-03 |
HK
Heung-Kyu Kwon
Overall (2019): #448,292 of 560,194Top 85%
1
Patents 2019