Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10403606 | Method of fabricating a semiconductor package | Heung-Kyu Kwon, Min-Ok Na, Sung-Woo Park, Ji Hyun Park | 2019-09-03 |
SP
Su-Min Park
Overall (2019): #256,856 of 560,194Top 50%
1
Patents 2019