Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10431522 | Thermal interface material layer and package-on-package device including the same | Min-Ok Na, Jongkook Kim, Jin-Woo Park, BongJin Son, Jangwoo Lee | 2019-10-01 |
HR
Hyo-Chang Ryu
Overall (2019): #437,969 of 560,194Top 80%
1
Patents 2019