Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10431522 | Thermal interface material layer and package-on-package device including the same | Min-Ok Na, Jongkook Kim, Hyo-Chang Ryu, Jin-Woo Park, BongJin Son | 2019-10-01 |
| 10319619 | Equipment for manufacturing semiconductor devices and method for use of same for manufacturing semiconductor package components | BongJin Son, Yose Eum | 2019-06-11 |
| 10171949 | Electronic apparatus and operating method thereof | Choonkyoung MOON, Ja-ok Koo, Hyunsoo NAH, Eunkyung YOO | 2019-01-01 |