Issued Patents 2019
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10476442 | Semiconductor package having an isolation wall to reduce electromagnetic coupling | Margaret A. Szymanowski, Sarmad K. Musa, Fernando A. Santos | 2019-11-12 |
| 10440813 | Microelectronic modules including thermal extension levels and methods for the fabrication thereof | Lu Li, Elie A. Maalouf, Lakshminarayan Viswanathan | 2019-10-08 |
| 10405417 | Packaged microelectronic component mounting using sinter attachment | Lakshminarayan Viswanathan, Lu Li, Paul R. Hart | 2019-09-03 |
| 10269678 | Microelectronic components having integrated heat dissipation posts, systems including the same, and methods for the fabrication thereof | Lakshminarayan Viswanathan, Lu Li, David F. Abdo, Geoffrey Tucker, Carl E. D'Acosta +3 more | 2019-04-23 |
| 10211177 | High power semiconductor package subsystems | Lakshminarayan Viswanathan, Scott M. Hayes, Scott D. Marshall | 2019-02-19 |