Issued Patents 2019
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10476442 | Semiconductor package having an isolation wall to reduce electromagnetic coupling | Margaret A. Szymanowski, Sarmad K. Musa, Mahesh K. Shah | 2019-11-12 |
| 10396006 | Molded air cavity packages and methods for the production thereof | Audel A. Sanchez, Lakshminarayan Viswanathan, Jaynal A. Molla | 2019-08-27 |
| 10375833 | Methods of manufacturing packaged electronic devices with top terminations | Lakshminarayan Viswanathan, Audel A. Sanchez, Jerry L. White | 2019-08-06 |
| 10199302 | Molded air cavity packages and methods for the production thereof | Audel A. Sanchez, Lakshminarayan Viswanathan, Jaynal A. Molla | 2019-02-05 |
| 10199303 | Molded air cavity packages and methods for the production thereof | Audel A. Sanchez, Lakshminarayan Viswanathan, Jaynal A. Molla | 2019-02-05 |