Issued Patents 2019
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10485091 | Microelectronic modules with sinter-bonded heat dissipation structures and methods for the fabrication thereof | Lakshminarayan Viswanathan, Elie A. Maalouf, Geoffrey Tucker | 2019-11-19 |
| 10431449 | Microelectronic systems containing embedded heat dissipation structures and methods for the fabrication thereof | Lakshminarayan Viswanathan, Geoffrey Tucker | 2019-10-01 |
| 10396006 | Molded air cavity packages and methods for the production thereof | Audel A. Sanchez, Lakshminarayan Viswanathan, Fernando A. Santos | 2019-08-27 |
| 10269678 | Microelectronic components having integrated heat dissipation posts, systems including the same, and methods for the fabrication thereof | Lakshminarayan Viswanathan, Mahesh K. Shah, Lu Li, David F. Abdo, Geoffrey Tucker +3 more | 2019-04-23 |
| 10199302 | Molded air cavity packages and methods for the production thereof | Audel A. Sanchez, Lakshminarayan Viswanathan, Fernando A. Santos | 2019-02-05 |
| 10199303 | Molded air cavity packages and methods for the production thereof | Audel A. Sanchez, Lakshminarayan Viswanathan, Fernando A. Santos | 2019-02-05 |