Issued Patents 2019
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10506704 | Electromagnetically-shielded microelectronic assemblies and methods for the fabrication thereof | Ramanujam Srinidhi Embar, Vikas Shilimkar | 2019-12-10 |
| 10485091 | Microelectronic modules with sinter-bonded heat dissipation structures and methods for the fabrication thereof | Jaynal A. Molla, Elie A. Maalouf, Geoffrey Tucker | 2019-11-19 |
| 10440813 | Microelectronic modules including thermal extension levels and methods for the fabrication thereof | Lu Li, Elie A. Maalouf, Mahesh K. Shah | 2019-10-08 |
| 10431449 | Microelectronic systems containing embedded heat dissipation structures and methods for the fabrication thereof | Jaynal A. Molla, Geoffrey Tucker | 2019-10-01 |
| 10405417 | Packaged microelectronic component mounting using sinter attachment | Lu Li, Mahesh K. Shah, Paul R. Hart | 2019-09-03 |
| 10396006 | Molded air cavity packages and methods for the production thereof | Audel A. Sanchez, Fernando A. Santos, Jaynal A. Molla | 2019-08-27 |
| 10375833 | Methods of manufacturing packaged electronic devices with top terminations | Audel A. Sanchez, Fernando A. Santos, Jerry L. White | 2019-08-06 |
| 10269678 | Microelectronic components having integrated heat dissipation posts, systems including the same, and methods for the fabrication thereof | Mahesh K. Shah, Lu Li, David F. Abdo, Geoffrey Tucker, Carl E. D'Acosta +3 more | 2019-04-23 |
| 10211177 | High power semiconductor package subsystems | Scott M. Hayes, Scott D. Marshall, Mahesh K. Shah | 2019-02-19 |
| 10199302 | Molded air cavity packages and methods for the production thereof | Audel A. Sanchez, Fernando A. Santos, Jaynal A. Molla | 2019-02-05 |
| 10199303 | Molded air cavity packages and methods for the production thereof | Audel A. Sanchez, Fernando A. Santos, Jaynal A. Molla | 2019-02-05 |