Issued Patents 2019
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10432148 | Phase shift and attenuation circuits for use with multiple-path amplifiers | Abdulrhman M. S. Ahmed, Mario M. Bokatius, Joseph Staudinger, Richard E. Sweeney | 2019-10-01 |
| 10405417 | Packaged microelectronic component mounting using sinter attachment | Lakshminarayan Viswanathan, Lu Li, Mahesh K. Shah | 2019-09-03 |
| 10269678 | Microelectronic components having integrated heat dissipation posts, systems including the same, and methods for the fabrication thereof | Lakshminarayan Viswanathan, Mahesh K. Shah, Lu Li, David F. Abdo, Geoffrey Tucker +3 more | 2019-04-23 |
| 10269729 | Semiconductor packages having wire bond wall to reduce coupling | Shun-Meen Kuo, Margaret A. Szymanowski | 2019-04-23 |
| 10211787 | Phase shift and attenuation circuits for use with multiple-path amplifiers | Abdulrhman M. S. Ahmed, Mario M. Bokatius, Joseph Staudinger, Richard E. Sweeney | 2019-02-19 |