Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10476442 | Semiconductor package having an isolation wall to reduce electromagnetic coupling | Sarmad K. Musa, Fernando A. Santos, Mahesh K. Shah | 2019-11-12 |
| 10269729 | Semiconductor packages having wire bond wall to reduce coupling | Shun-Meen Kuo, Paul R. Hart | 2019-04-23 |
| 10211784 | Amplifier architecture reconfiguration | Ramanujam Srinidhi Embar, Roy McLaren | 2019-02-19 |