Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10485091 | Microelectronic modules with sinter-bonded heat dissipation structures and methods for the fabrication thereof | Jaynal A. Molla, Lakshminarayan Viswanathan, Elie A. Maalouf | 2019-11-19 |
| 10431449 | Microelectronic systems containing embedded heat dissipation structures and methods for the fabrication thereof | Jaynal A. Molla, Lakshminarayan Viswanathan | 2019-10-01 |
| 10269678 | Microelectronic components having integrated heat dissipation posts, systems including the same, and methods for the fabrication thereof | Lakshminarayan Viswanathan, Mahesh K. Shah, Lu Li, David F. Abdo, Carl E. D'Acosta +3 more | 2019-04-23 |