Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10485091 | Microelectronic modules with sinter-bonded heat dissipation structures and methods for the fabrication thereof | Jaynal A. Molla, Lakshminarayan Viswanathan, Geoffrey Tucker | 2019-11-19 |
| 10440813 | Microelectronic modules including thermal extension levels and methods for the fabrication thereof | Lu Li, Lakshminarayan Viswanathan, Mahesh K. Shah | 2019-10-08 |
| 10381984 | Amplifiers and amplifier modules with shunt inductance circuits that include high-Q capacitors | Yu-Ting David Wu, Enver Krvavac, Joseph Gerard Schultz, Nick Yang, Damon G. Holmes +3 more | 2019-08-13 |