Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10388607 | Microelectronic devices with multi-layer package surface conductors and methods of their fabrication | Zhiwei Gong, Michael B. Vincent | 2019-08-20 |
| 10211177 | High power semiconductor package subsystems | Lakshminarayan Viswanathan, Scott D. Marshall, Mahesh K. Shah | 2019-02-19 |