Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10388607 | Microelectronic devices with multi-layer package surface conductors and methods of their fabrication | Scott M. Hayes, Michael B. Vincent | 2019-08-20 |
| 10283477 | Method of fabricating 3-dimensional fan-out structure | Wei Gao, Dehong Ye | 2019-05-07 |