Issued Patents 2019
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522485 | Electrical device and a method for forming an electrical device | Christian Geissler, Sven Albers, Georg Seidemann, Andreas Wolter, Thomas Wagner +1 more | 2019-12-31 |
| 10490527 | Vertical wire connections for integrated circuit package | Christian Geissler, Sven Albers, Georg Seidemann, Andreas Wolter, Thomas Wagner +1 more | 2019-11-26 |
| 10446541 | Advanced node cost reduction by ESD interposer | Georg Seidemann, Christian Geissler | 2019-10-15 |
| 10411000 | Microelectronic package with illuminated backside exterior | Marc Dittes, Sven Albers, Christian Geissler, Andreas Wolter, Georg Seidemann +2 more | 2019-09-10 |
| 10403609 | System-in-package devices and methods for forming system-in-package devices | Christian Geissler, Sven Albers, Georg Seidemann, Andreas Wolter, Thomas Wagner +1 more | 2019-09-03 |
| 10366968 | Interconnect structure for a microelectronic device | Andreas Wolter, Georg Seidemann, Thomas Wagner, Bernd Waidhas | 2019-07-30 |
| 10228725 | Flexible band wearable electronic device | Sven Albers, Andreas Wolter, Georg Seidemann, Christian Geissler, Thorsten Meyer +1 more | 2019-03-12 |
| 10209466 | Integrated circuit packages including an optical redistribution layer | Georg Seidemann, Christian Geissler, Sven Albers, Thomas Wagner, Marc Dittes +2 more | 2019-02-19 |
| 10186499 | Integrated circuit package assemblies including a chip recess | Georg Seidemann | 2019-01-22 |
| 10170409 | Package on package architecture and method for making | Sanka Ganesan, John S. Guzek, Nitesh Nimkar, Thorsten Meyer | 2019-01-01 |