Issued Patents 2019
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10396003 | Stress tuned stiffeners for micro electronics package warpage control | Mark E. Tuttle | 2019-08-27 |
| 10366934 | Face down dual sided chip scale memory package | Akshay N. Singh, Yi Xu, Liana Foster, Steven Eskildsen | 2019-07-30 |
| 10325874 | Device module having a plurality of dies electrically connected by posts | Ashok Pachamuthu, Szu-Ying Ho, John F. Kaeding | 2019-06-18 |
| 10304805 | Dual sided fan-out package having low warpage across all temperatures | Mark E. Tuttle | 2019-05-28 |
| 10276487 | Semiconductor device with flexible circuit for enabling non-destructive attaching and detaching of device to system board | Eiichi Nakano | 2019-04-30 |
| 10192843 | Methods of making semiconductor device modules with increased yield | Ashok Pachamuthu, Szu-Ying Ho, John F. Kaeding | 2019-01-29 |