Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10366934 | Face down dual sided chip scale memory package | Chan H. Yoo, Akshay N. Singh, Yi Xu, Liana Foster | 2019-07-30 |
SE
Steven Eskildsen
Overall (2019): #263,652 of 560,194Top 50%
1
Patents 2019