Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522507 | Semiconductor device assemblies including multiple shingled stacks of semiconductor dies | Hong Wan Ng | 2019-12-31 |
| 10366934 | Face down dual sided chip scale memory package | Chan H. Yoo, Yi Xu, Liana Foster, Steven Eskildsen | 2019-07-30 |
| 10312219 | Semiconductor device assemblies including multiple shingled stacks of semiconductor dies | Hong Wan Ng | 2019-06-04 |