Issued Patents 2019
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10366934 | Face down dual sided chip scale memory package | Chan H. Yoo, Akshay N. Singh, Liana Foster, Steven Eskildsen | 2019-07-30 |
| 10332899 | 3D package having edge-aligned die stack with direct inter-die wire connections | Florence R. Pon, Yong She | 2019-06-25 |
| 10213782 | Microfluidic devices | Ryan C. Bailey, Steven Doonan | 2019-02-26 |