Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10366934 | Face down dual sided chip scale memory package | Chan H. Yoo, Akshay N. Singh, Yi Xu, Steven Eskildsen | 2019-07-30 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10366934 | Face down dual sided chip scale memory package | Chan H. Yoo, Akshay N. Singh, Yi Xu, Steven Eskildsen | 2019-07-30 |