Issued Patents 2019
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10483198 | Post-grind die backside power delivery | Min-Tih Lai, Tyler Leuten | 2019-11-19 |
| 10332899 | 3D package having edge-aligned die stack with direct inter-die wire connections | Yi Xu, Yong She | 2019-06-25 |