Issued Patents 2019
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10468382 | Signal delivery in stacked device | Brent Keeth, Mark Hiatt, Terry R. Lee, Rahul Advani, John F. Schreck | 2019-11-05 |
| 10396003 | Stress tuned stiffeners for micro electronics package warpage control | Chan H. Yoo | 2019-08-27 |
| 10307850 | Solder removal from semiconductor devices | — | 2019-06-04 |
| 10304805 | Dual sided fan-out package having low warpage across all temperatures | Chan H. Yoo | 2019-05-28 |
| 10261123 | Semiconductor device structures for burn-in testing and methods thereof | — | 2019-04-16 |