Issued Patents 2019
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10446527 | Stacked semiconductor dies including inductors and associated methods | — | 2019-10-15 |
| 10418255 | Semiconductor device packages and related methods | — | 2019-09-17 |
| 10319696 | Methods for fabricating 3D semiconductor device packages, resulting packages and systems incorporating such packages | — | 2019-06-11 |
| 10276487 | Semiconductor device with flexible circuit for enabling non-destructive attaching and detaching of device to system board | Chan H. Yoo | 2019-04-30 |
| 10217726 | Stacked semiconductor dies including inductors and associated methods | — | 2019-02-26 |